Intermediate wafer level bonding and interface behavior

Interface structures in GaAs wafer bonding: Application to compliant substrates

Amorphous Silicon Direct Bonding (a-SDB) with Improved Surface Roughness

Silicon direct bonding (SDB) is a bonding technique of two silicon wafers together with homogeneous or heterogeneous layers without the use of any intermediate adhesives. The SDB technique simplifies the process and cost by reducing mask level, and its necessity has increased in terms of its fields of applications such as power devices, SOI, sensors and actuators. Factors which can affect direc...

Low Temperature Copper-Nanorod Bonding for 3D Integration

Wafer bonding is an emerging technology for fabrication of complex three-dimensional (3D) structures; particularly it enables monolithic wafer-level 3D integration of high performance, multi-function microelectronic systems. For such a 3D integrated circuits, lowtemperature wafer bonding is required to be compatible with the back-end-of-the-line processing conditions. Recently our investigation...

Selective low temperature microcap packaging technique through flip chip and wafer level alignment

In this study, a new technique of selective microcap bonding for packaging 3-D MEMS (Micro Electro Mechanical Systems) devices is presented. Microcap bonding on a selected area of the host wafer was successfully demonstrated through flip chip and wafer level alignment. A passivation treatment was developed to separate the microcap from the carrier wafer. A thick metal nickel (Ni) microcap was f...

Wafer-to-Wafer Bonding for Microstructure Formation

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...